RFMW White Paper – GaAs and GaN Die Assembly and Handling Procedures

Qorvo White Paper on GaAs and GaN Die Assembly and Handling ProceduresRFMW offers a Qorvo white paper outlining methods for proper handling, component placement, optimum attachment methods, and interconnect techniques for use with GaN and GaAs microwave monolithic integrated circuits (MMICs) in electronic
assemblies.

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