RFMW announces design and sales support for microwave stress relief contacts. The Anritsu S110-3 sliding contact is designed to slip over the pin of glass bead interfaces in microstrip or hybrid circuit housings. This minimizes the danger of solder connection or bond wire breakage during thermal and mechanical movement of the housing and microcircuit. The S110-3 fits 12 mil (0.38 mm), glass-feedthrough, center conductors for connection to microstrip or coplanar waveguide designs on Duroid substrates. Operational to 40 GHz, they are made of heat-treated BeCu with a bondable gold over nickel plating.