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Smiths Interconnect at RFMW Booth IMS2024

Smiths Interconnect speaks at RFMW Booth at IMS2024 about their exceptional TSX WB1 Wire Bondable Series for space & defense applications.
Jennifer GaughranBy Updated:No Comments1 Min Read

We spoke with Dave Raymond from Smiths Interconnect at IMS2024 about their exceptional TSX WB1 Wire Bondable Series. The TSX Chip Attenuators offer excellent performance and power from DC-50 GHz in a small 0604 or 0404 package size. Showcased here are the tiny 0404 products, ideal for space and defense applications, and anywhere where top performance and tiny footprint is critical.

Highlighted Products

TSX Wire Bondable Series, full TSX Offering on RFMW 

Learn more

TSX Series Datasheet on Smiths Interconnect Website

Full Smiths Interconnect EMC product listing on RFMW site. 

Smiths Interconnect with RFMW at IMS2024 talk about their exceptional TSX WB1 Wire Bondable Series

Author

  • Jennifer Gaughran

    Jennifer Gaughran is the Marketing Communications Manager at RFMW, with over 20 years of marketing experience and more than 15 years in the RF and Microwave industry. She specializes in developing and executing integrated marcom strategies, combining technical creativity with hands-on project management. Outside of work, Jennifer co-created The Adventures of Red Knight, a children’s audio adventure podcast.
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Jennifer Gaughran

Jennifer Gaughran is the Marketing Communications Manager at RFMW, with over 20 years of marketing experience and more than 15 years in the RF and Microwave industry. She specializes in developing and executing integrated marcom strategies, combining technical creativity with hands-on project management. Outside of work, Jennifer co-created The Adventures of Red Knight, a children’s audio adventure podcast.

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