What made you choose ED2’s ED2-0023 StingArray™ Phased Array Antenna Module? How does this product differ from others on the market?
I selected the ED2-0023 StingArray™ Phased Array Antenna Module because its innovative design offers significant advantages for designers of beamforming networks. This module simplifies the RF front-end layout and implementation while delivering enhanced performance compared to more traditional methods.
What challenges is the ED2-0023 StingArray™ designed to address?
Beamforming ICs are a widely used approach in RF front-end design for phased array solutions, especially at frequencies above 6 GHz. One major challenge in phased array antenna design is fitting a large number of individual RF functions—such as low noise amplifiers (LNA), phase shifters, power amplifiers (PA), transmit/receive (TR) switches, and attenuators—into a compact space behind the antenna’s radiating element. As antenna spacing is directly proportional to wavelength, higher frequencies result in smaller available spaces for electrical components. Beamforming ICs address this issue by integrating these functionalities into a much smaller footprint than what could be achieved with discrete components.
However, beamforming ICs, while essential for most phased arrays, present their own set of challenges. They are relatively power-intensive and are densely packed on a PCB near the antenna, which can lead to issues with heat dissipation. Additionally, the RF transmission path to the antenna can suffer losses that degrade system performance. The complexity of PCB assembly in a large array can also cause yield issues and necessitate reworking high-value assemblies.
How does the ED2-0023 StingArray™ help overcome these challenges?
The ED2-0023 StingArray™ Phased Array Antenna Module integrates commercially available beamformer ICs into a complete 2×2 antenna assembly using ED2’s Advanced Glass Packaging Technology. The antennas are embedded within the substrate material and connect directly to the beamformer through fully hermetic via holes, which minimizes line losses. This design manages all DC and RF routing within the package, greatly simplifying the customer’s design process. Additionally, embedded vias within the package maximize thermal dissipation. The result is a fully tested and integrated 2×2 antenna array with built-in beamforming capabilities that can be easily surface-mounted onto any PCB, significantly reducing design cycles and associated risks.
The ED2-0023 module integrates the Renesas F5288 n257 band IC to showcase the technology and can be adapted to integrate any IC from the Ku band and higher frequencies.
What are the key features and specifications of the ED2-0023?
- Integrated Beamformer IC
- SMT SIP operates from 26.5–29.5 GHz
- Spatially combines 4 channels,
- EIRP +37 dBm
- +48.7 dB of total gain for transmit (Tx)
- +34.4 dB of total gain for receive (Rx)
- Internal temp sensor and power detector
- Custom designs available
What are common markets and applications of the ED2-0023?
- n257 Communications Networks
- Phased Array Radar
- SATCOM
About Colin Field
Colin Field is an RFMW Supplier Business Manager responsible for passive components with a particular focus on RF Filters and antenna solutions. Beginning his career in 1984, Colin has a passion for physics which has led to a lifelong interest in materials technology, properties and the potential uses and applications of those materials.
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