Nick John from RFMW meets with with Srinidhi Embar from Axiro Semiconductor to discuss two of Axiro’s latest high-performance power amplifier (PA) modules designed for next-generation wireless infrastructure.
In this interview, Sri introduces the F84010 and F84232 PA modules, highlighting their applications in 4G/5G massive MIMO systems, compact integration, and high-efficiency performance for wireless infrastructure deployments.
Featured Products:
F84010
▪️1.8 to 2.2 GHz TX multi-chip PA module
▪️Designed for 32T/32R massive MIMO systems
▪️16W average output power
▪️Up to 52 dBm peak output power
▪️Approximately 46% linearized PAE with 46 dB gain
▪️DPD-friendly 365 MHz instantaneous bandwidth
▪️Compact 20 × 18 mm, 22-lead LGA package
F84232
▪️3.4 to 3.8 GHz PA module with integrated bias control
▪️Designed for 64T/64R 5G massive MIMO applications
▪️8W average output power
▪️48 dBm peak output power
▪️Approximately 50% linearized PAE with 30 dB gain
▪️DPD-friendly 400 MHz instantaneous bandwidth
▪️Integrated bias controller for TDD switching and temperature compensation
▪️Compact 12 × 8 mm, 34-lead LGA package
The F84010 is in full production with samples available today, while the F84232 is scheduled for production release in early 2027, with engineering samples and evaluation kits already available.
