As a global leader in high-performance RF, microwave, and fiber optic interconnects, Rosenberger is recognized as a key enabler of next-generation quantum computing platforms. Leveraging over 60 years of innovation in miniature, non-magnetic, and high-density designs for demanding applications, including semiconductor testing, defense, and medical, Rosenberger is uniquely positioned to take on the complex challenges posed by cryogenic quantum computing.
Solving Real-World Quantum Design Challenges
Quantum computers, particularly those based on superconducting qubits, are built inside dilution refrigerators that cool down to a few millikelvins, colder than deep space. At each stage of the cryostat, the interconnect components must preserve signal integrity while avoiding heat transfer, magnetic interference, and mechanical failure. Rosenberger’s expertise in materials science, high-frequency packaging, and system-level design makes them a trusted partner in navigating this extreme environment.
From the outermost stage of the cryostat to the quantum processor at the lowest level, signal lines must pass through progressively colder layers, each demanding tighter thermal, mechanical, and magnetic constraints. According to Rosenberger’s Nick Parker, “We’re penetrating deeper and deeper into this lab-created abyss… our customers are telling us under no circumstances can we violate this delicate cryogenic environment with any noise, any magnetism, [or] any thermal changes.”
Rising to the challenge, Rosenberger meets these stringent requirements through advanced material selection and purpose-built connector designs. For example, their new approach to conventional RF practices uses stainless steel coaxial cables on the input path to deliberately attenuate unwanted noise. On the output path, where signals from qubits are incredibly weak, Rosenberger uses superconducting niobium-titanium cables to transmit data with zero energy loss.
Designed for Density, Reliability, and Scale
Quantum systems are scaling rapidly, with more qubits requiring more signal lines and denser packaging. This results in three major challenges: increased thermal load, limited physical space, and higher risk of interference. Rosenberger directly addresses these with its high-density multiport connector systems, including WSMP, SMPX, and HPX families, many of which were originally developed for space-constrained military and test environments.
Featuring blind-mate capability, non-magnetic AuroDur® plating, and pitches as tight as 2.5 mm, these connectors are ideal for complex PCB stack-ups and routing inside cryostats. Already included in most of Rosenberger’s standard portfolio, this advanced feature set enables cryogenic-grade interconnect integration without the delays and costs of full-custom development.
With in-house machining, lithographic contact fabrication, and even contactless interconnect R&D underway, Rosenberger continues to lead as quantum computing moves toward scalable commercial deployments.
Rosenberger Cryo-Qualified Interconnect Solutions Now Available at RFMW
Specifically engineered for quantum computing environments, Rosenberger cryogenic interconnect assemblies and connectors preserve fragile qubit signals throughout extreme temperature fluctuations. Their material and mechanical design choices support both attenuation control and superconducting performance.
Rosenberger Cryogenic Interconnect Key Benefits:
- Non-magnetic construction: All components utilize non-magnetic materials and proprietary AuroDur® gold plating to avoid magnetic interference with qubits
- Stainless steel input lines: High-attenuation stainless steel coaxial cables suppress unwanted noise entering the cryostat
- Superconducting output lines: Niobium-titanium semi-rigid coax provides ultra-low-loss signal return paths for weak qubit readouts
- High-density multiports: Connector systems with 2.5 mm pitch enable compact, space-saving integration, ideal for crowded cryostat stages
- Blind-mate interfaces: Options like WSMP and SMPX simplify assembly in thermally isolated and mechanically constrained environments
- Flexible standard and custom options: Rosenberger adapts proven RF channels into application-specific housings without costly full-custom development
- Vertical integration: Precision in-house machining and advanced lithographic techniques support micron-level tolerances for next-generation designs
Learn more about Rosenberger Cryogenic Interconnect components.
Download the Rosenberger Cryogenic and Quantum Technology flyer.
Read more about the Rosenberger SMPX Series in our Expert Product Pick.
Want to learn more about RF cryogenic components? Read more in our article, “Developing Future-Ready RF Quantum Solutions for Cryogenic Environments“.
