At IMS 2026, RFMW’s Kevin McCormack speaks with Jamie Frederick of Rosenberger North America to discuss the new HPX™ Compression Mount Series, an innovative high-performance interconnect system designed to simplify RF connections while delivering exceptional performance up to 110 GHz.
Developed in response to industry demands for smaller, faster, and more cost-effective interconnect solutions, the HPX series features a blind-mate, solderless compression mount design that enables direct-to-board connectivity without permanently attaching a connector to the PCB. The result is a flexible, field-serviceable solution that reduces maintenance costs and simplifies system upgrades.
In this interview, Jamie explains how the HPX platform supports applications ranging from quantum computing, aerospace and defense, and test and measurement to medical systems and industrial robotics. The modular design is available in multiple configurations, from single-channel to high-density 32-channel layouts, making it easy to scale for a wide range of system architectures.
Key Features
- High-performance interconnect system up to 110 GHz
- Blind-mate interface for fast, reliable connections
- Solderless compression mount design
- Direct-to-board architecture
- High-density standard and staggered layouts
- Field-repairable design minimizes downtime
- Multiple channel configurations for scalable system designs
