Author: Jennifer Gaughran

The articles provide readers with a comprehensive understanding of the fundamentals and challenges associated with satellite networks.

In this on-demand webinar recording, expert speaker Paul Prudhomme, of Qorvo’s Defense and Aerospace business, will delve into the architectural differences between these satellite systems, market trends, and the growing role of electronically scanned arrays (ESAs) in multi-orbit, high-throughput applications. Webinar Details Webinar publication date: Wednesday, October 30, 2024, 8:00 AM PT / 11:00 AM ET View On-demand Recording More Qorvo SATCOM Resources RFMW Qorvo SATCOM page

Learn how to simulate the performance of complete analog and mixed-signal circuits with next-gen speed and unmatched accuracy with Qorvo’s QSPICE. In this on-demand webinar recording, author of QSPICE Mike Engelhardt showcases its intuitive user interface, a simple process for importing 3rd party models and support for massive amounts of digital logic without performance penalties. Webinar Details Webinar publication date: Tuesday, Oct 15, 2024, 8:00 AM PT / 11:00 AM ET View On-demand Recording More QSPICE Resources Article: What You Need to Know About SiC and Qorvo’s QSPICE Simulator Qorvo QSPICE resources

Thank you for visiting RFMW at European Microwave Week in Paris! EuMW 2024 had record attendance this year with more than 5,000 attendees and the most square meters of show space in the history of the show. It was a delight to showcase our suppliers’ industry-leading products. A big thank you goes to our featured suppliers, including Qorvo, Smiths Interconnect, Marki Microwave, TTM Technologies, Menlo Micro, Ampleon, Knowles Precision Devices, Nuvotronics, Spectrum Control, CML Micro, ED2, SiTime, Micross Hi-Rel RF Solutions, pSemi, NXP Semiconductors, and Guerrilla RF. We enjoyed speaking with customers, partners, and suppliers about exciting new technology and…

https://youtu.be/h82ln0BzmAQ We spoke with Tim Smith from Nuvotronics at IMS2024 about their impressive new PolyStrata® technology air cavity packages. The low-frequency and high-frequency product lines of copper packages cover a combined DC to 90 gigahertz while maintaining low loss and high performance. These packages deliver best-in-class RF and thermal performance and have been optimized from the ground up for mmWave applications. Highlighted Products PolyStrata® Air Cavity Packages Watch On-demand Webinar on PolyStrata® Technology on Microwave Journal Website Read our Expert Product Pick: Nuvotronics High-Performance, mmWave Packaging View all Nuvotronics products on RFMW Website 

https://youtu.be/xvCU2zlbW9I We spoke with Arwyn Roberts from CML Micro at IMS2024 about their new CMX90A705, a 5.5 watts Ka-band MMIC which covers 27.5 up to 31 GHz with 5.5 Watts of saturated power and 16.5 dB gain. He also gave us a preview of the CMX90A006, which will be officially launched during European Microwave week 2024. Highlighted Product CMX90A705 The CMX90A705 is a packaged two-stage Ka-band GaN linear power amplifier delivering 37.4 dBm (5.5 W) of saturated power with 16.5 dB of small signal gain. It can be used as both driver stage and final stage PA in a commercial…

https://youtu.be/DwQAluVMXxU We spoke with Katie Agostinelli from Spectrum Control at IMS2024 about their new Powerfilm Chip Attenuator Designer Kit. The kit contains samples from 13 different attenuation values for both the PCAAW and PCAAF family series from Spectrum Control, making it easier to test out and select the best component for each design. Highlighted Products PCAAW-Series This series features Powerfilm chip attenuators with a frequency range up to DC-18 GHz and attenuation levels from 0 to 20 dB. This surface-mount resistive component has wrap around ground, AIN substrate, and thin resistor film. Products provide reduced signal level, improved impedance match…

Get an in-depth look into the world of RF power splitters and combiners.

https://youtu.be/Ya_hdIYvNzM We spoke with Dave Raymond from Smiths Interconnect at IMS2024 about their exceptional TSX WB1 Wire Bondable Series. The TSX Chip Attenuators offer excellent performance and power from DC-50 GHz in a small 0604 or 0404 package size. Showcased here are the tiny 0404 products, ideal for space and defense applications, and anywhere where top performance and tiny footprint is critical. Highlighted Products TSX Wire Bondable Series, full TSX Offering on RFMW Learn more TSX Series Datasheet on Smiths Interconnect Website Full Smiths Interconnect EMC product listing on RFMW site.

In this on-demand webinar recording, expert speaker Tim Smith will be discussing PolyStrata®, a groundbreaking technology enabling the creation of high-performance RF packages with form factors similar to traditional QFNs. Webinar Details Webinar publication date: Thursday, September 5, 2024, 8:00 AM PT / 11:00 AM ET https://youtu.be/hreLk1lgMsY