RFMW Ltd., announces design and sales support for a new line of dual use RF Absorber + Thermally Conductive pad material. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders used on RF components. New designs often include miniaturization as a design goal forcing the product packaging and heat sinking to be an integral part of the solution. Material advancements such as GaN, with its higher power densities, exacerbate the problem engineers face with removing heat from their designs. Once that problem is solved, the resulting RF reflections created by the heat sink’s surface can cause performance robbing resonances. Suppress-n-Sink is a low-cost, flexible solution to both of these problems. Produced in sheets, Suppress-n-Sink material can be die cut to any shape. The materials are formulated for high thermal conductivity as well as EMI/RF attenuation across a broad frequency range. The high thermal conductivity enables designers to mount this material directly on top of a packaged chip for heat transfer while also suppressing electromagnetic energy.
Four products are currently available in varying thickness for EMI suppression of resonances up to 4GHz. All sheet sizes are 11.5 x 8.25 inches.
MS32-0001-00 for 0.8 – 4 GHz applications is 0.020″ thick
MS32-0002-00 for 0.5 – 4 GHz applications is 0.040″ thick
MS32-0003-00 for 0.2 – 4 GHz applications is 0.060″ thick
MS32-0004-00 for 0.05 – 4 GHz applications is 0.080″ thick