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RFMW announces availability of a white paper from Smiths Interconnect – “Fixture Preparation and RF Test of SMT Board Level Components at High Frequencies”. As the applications in modern telecommunications shift beyond 20 GHz, so does the need for RF components and systems at these frequencies. To properly support introduction of new technologies at frequencies of K-band, Ku-band and further towards millimeter wave, all aspects of component design and development must be considered including high frequency fixturing and probing and production testing. |