High Frequency Fixture Preparation White Paper

Smiths Interconnect offers “Fixture Preparation and RF Test of SMT Board Level Components at High Frequencies” White Paper

 

RFMW announces availability of a white paper from Smiths Interconnect – “Fixture Preparation and RF Test of SMT Board Level Components at High Frequencies”. As the applications in modern telecommunications shift beyond 20 GHz, so does the need for RF components and systems at these frequencies. To properly support introduction of new technologies at frequencies of K-band, Ku-band and further towards millimeter wave, all aspects of component design and development must be considered including high frequency fixturing and probing and production testing.


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About the Author
John Hamilton has over 40 years of experience in RF and Microwave technology, applications, technical support and marketing. He is the Vice President of Marketing at RFMW, holds multiple degrees and has a background in Test & Measurement.

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