RFMW White Paper – GaAs and GaN Die Assembly and Handling Procedures

Qorvo White Paper on GaAs and GaN Die Assembly and Handling ProceduresRFMW offers a Qorvo white paper outlining methods for proper handling, component placement, optimum attachment methods, and interconnect techniques for use with GaN and GaAs microwave monolithic integrated circuits (MMICs) in electronic
assemblies.

About the Author
John Hamilton has over 40 years of experience in RF and Microwave technology, applications, technical support and marketing. He is the Vice President of Marketing at RFMW, holds multiple degrees and has a background in Test & Measurement.

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